- · Lead and lead-free soldering of elements
- · SMD and DIP assembly
- · Installing BGA packages
- · Flexible PCB Mounting
- · Mounting on aluminum plates
- · Manufacturing of cables, cable assemblies and loops
- · Assembling products into the case
Product Category: | PCBA OEM |
SMT placement daily production capacity | 8 million points |
BGA placement capability | 0.3mm ball pitch |
Reflow soldering temperature zone | Nitrogen ten temperature zone reflow soldering |
Mounting component size | 01005~45mm*45mm (IC) |
Maximum pasteable and ovenable size | 810mm*450mm |
AOI test height limit | surface <28mm, bottom surface <75mm |
DIP welding assembly daily production capacity | 100,000 points |
SMT production lines | 7 |
Length of test assembly line | 16m |
Ultrasonic assembly | support |
DIP welding assembly line | 6 |
The maximum size of the three anti-paint machine spray | 40cm*40cm |
ICT test: | support |

