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If you work in the field of event organization and technology, you must have heard of DOUBLE SIDED SMT ASSEMBLY technology. However, if you are "new to the industry", it is difficult to explain what the concept of SMT is? What advantages and disadvantages does it have?
SMT stands for “Surface Mount Technology” - refers to the electronic technology industry with the board system, also known more commonly as surface-gluing technology.
Currently, this is the main technology applied in the assembly of PCBs for electronic production. DOUBLE SIDED SMT ASSEMBLY components are very small in structure and commonly used types are in the billions, especially SMT capacitors and resistors are more common.
Regarding SMT technology, it was developed in the 1960s and widely applied in 1980. And IBM Corporation of the United States has been a pioneer in the application and pioneering of this technology.
DOUBLE SIDED SMT ASSEMBLY technology was developed in the 1960s and was widely adopted in the late 1980s. IBM Corporation of America can be considered the pioneer in the application of this technology.
Surface mount technology was developed in the 1960s. By 1986, surface mount components accounted for at most 10% of the market, but were rapidly gaining popularity. In the late 1990s, the majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
This is a common method of manufacturing circuit boards today in circuit board factories with automatic and semi-automatic assembly lines of electronic components. In which electrical components and electronic components are mounted directly on the surface of the printed circuit board (PCB). This is the core technology of the current electronic component assembly line.
The stages can be performed through one, several automatic machines, or a whole assembly line of electronic circuit board components to create the finished product. Today, the operating process of DOUBLE SIDED SMT ASSEMBLY machines ensures picking (picking up electronic components from the conveyor belt, vibrating hopper, feed vibrating bar, tray ...) and place (putting in the upper position). Printed circuit board) is made with small errors, and high accuracy.
Have you ever been curious about how the washing machine switches to different function modes when you just press some buttons? The secret behind is a PCBA, printed circuit board assembly.
In today's life, an electric machine is not just a cable plus a single-function device, but a "helper" with various capabilities.
PCBA makes this possible by bringing together different types and assemblies of electronic components on a very small area of a substrate known as the PCB, providing a circuit that can take care of tasks; Complex and multifunctional
Because SMT machines are computer-controlled precision mechanical machines equipped with the most modern technologies such as image processing technology… An electrical and electronic component mounted in this way is called a device. Surface Mount Device (SMD-Surface Mount Device). In the circuit board manufacturing, and circuit board assembly industry, this approach has largely replaced through-hole technology.
At that time most electronic components had to be mechanically machined to attach a piece of metal to the ends so that they could be soldered directly onto the printed circuit board.
However, when applying SMT technology, each component is fixed on the surface of the printed circuit board with a very small lead-coated area, and on the other side of the PCB, the component is only fixed with a similar solder paste. . As a result, the physical size of the component is reduced.
The right method of assembling electronic components, largely due to SMT, allows for increased automation of production, reduced costs, and improved quality. It also allows more components to fit on a given area of the circuit board substrate.
Both technologies can be used on the same board, with common hole technology used for electronic components not suitable for surface mounting such as large transformers and power semiconductors Radiators.
An SMT device is typically smaller than its through-hole component because it has smaller conductors or no conductors at all. It can have short pins or leads of various styles, flat contacts, solder ball matrix (BGA), or terminals on the body of the component.
SMT technology has a high degree of automation, does not require many workers, and increases production capacity.
Currently, the operating procedure for SMT machines is to ensure that the pick up (installation from the component position) and Place (placement on the printed circuit board) are performed with extreme error small and limited. Because this machine is integrated with the most modern and advanced image processing technology today.
SMT line is a new technology applied in the production of electronic circuits. Before the advent of SMT technology, electrical circuits were connected by wires, so electronic products were often very bulky.
So to optimize the size, the IC was born, designed to be mounted on a smaller circuit board (PCB), on which other devices such as diodes, capacitors, resistors, etc. can be mounted, etc. (small size) ).
All that technology is called the SMT production line.
SMT production lines are classified into automatic and semi-automatic SMT lines (in terms of automation level) or small and medium-sized SMT lines (in terms of scale and size of production lines).
With different manufacturers, there will be different processes and ways of working, attaching Chips to be able to create Chip-mounted machines on SMT lines. However, no matter what stage and process you start at, you need to ensure the following 4-step process:
Step 1: Scan the solder alloy
Step 2: Insert Chip, install IC
Step 3: Heating – cooling
Step 4: Check and fix errors
As of today, SMT is at the top of the charts, and SMT technology and production line is the most popular electronic assembly process. And in 1 SMT there are common devices with different functions. As follows:
There are quite a few different concepts of passive SMT. However, when talking about passive SMD; it is mostly understood as SMT resistors or SMT capacitors with standardized package sizes.
Regarding resistors and capacitors, there will be various package sizes, including 1812, 0805, 1206, 0603, 0402, and 0201. And those mentioned can be up to hundreds of inches. Currently, they are not commonly used because of the smaller number of components, but passive SMTs can still be found in applications where a larger power source is required, or other larger requirements are considered.
The connections of the circuit board will be made through the metal-plated areas on the first two parts of the package.
The transistors and diodes are usually contained in a rather small plastic package. And connections are made simply through the leads emanating from the package and then bending so that they can touch the board.
There are many packages used for integrated circuits, it depends on the level of connection required
For chips with basic logic, only 14 to 16 pins are needed. As for other Chips such as VLSI processors and related chips it can go up to 200 or more.
Small chips such as SOIC packages can also be used. This is the SMT version of the DIL packages, used for Logic 74 Series chips.
Available packages, also known as BGA (Ball Grid Array) are selected to be used in many different applications. Instead of side-by-side connections, they are connected directly below the packet.
In addition to the outstanding advantages mentioned above, SMT technology also has some disadvantages that need to be overcome in the future such as:
Currently, in the electronics industry: Then SMT surface gluing technology has replaced most of the component packaging technologies on through-hole PCB panels. Components in the PCB are firmly fixed by through-hole soldering through hot lead baths. With different brands, it will own its own proprietary know-how on other technologies when creating machines that mount chips on SMT transmission lines.